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CS5207A-1 Datasheet(PDF) 7 Page - ON Semiconductor |
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CS5207A-1 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 8 page CS5207A−1 http://onsemi.com 7 The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: PD(max) + (VIN(max) * VOUT(min))IOUT(max) ) VIN(max) IIN(max) A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine the total thermal resistance between the die junction and the surrounding air, RΘJC. This total thermal resistance is comprised of three components. These resistive terms are measured from junction to case (RΘJC), case to heat sink (RΘCS), and heat sink to ambient air (RΘSA). The equation is: RQJA + RQJC ) RQCS ) RQSA RΘJC is rated @ 1.4°C/W for the CS5207A−1. For a high current regulator such as the CS5207A−1 the majority of heat is generated in the power transistor section. The value for RΘSA depends on the heat sink type, while the RΘCS depends on factors such as package type, heat sink interface (is an insulator and thermal grease used?), and the contact area between the heat sink and the package. Once these calculations are complete, the maximum permissible value of RΘJA can be calculated and the proper heat sink selected. For further discussion on heat sink selection, see application note “Thermal Management,” document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com. |
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