TCP−4156UB

www.onsemi.com

7

PACKAGE DIMENSIONS

WLCSP4, 1.009x0.609

CASE 567LZ

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

4. BACKSIDE TAPE APPLIED TO IMPROVE

PIN 1 MARKING.

2X

DIM

A

MIN

MAX

0.275

MILLIMETERS

A1

D

1.009 BSC

E

b1

0.044

0.094

e

0.420 BSC

0.345

E

D

A B

PIN A1

REFERENCE

0.05 C

B

A

0.06 C

A1

C

0.045

0.085

0.609 BSC

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

e1

0.400 BSC

12

b

0.079

0.129

A

DETAIL A

DETAIL A

A

0.05

B

C

0.03 C

4X

b

e1

4X

b1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DETAIL C

DETAIL C

NOTE 4

TAPE

DIMENSIONS: MILLIMETERS

PACKAGE

OUTLINE

A1

0.13

4X

0.55

0.55

0.15

4X

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