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NCP1235AD065R2G Datasheet(PDF) 4 Page - ON Semiconductor

Part # NCP1235AD065R2G
Description  Fixed Frequency Current Mode Controller
Download  34 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP1235AD065R2G Datasheet(HTML) 4 Page - ON Semiconductor

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NCP1235
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4
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Pin (pin 6) (Note 2)
Voltage range
Current range
VCCMAX
ICCMAX
–0.3 to 28
$30
V
mA
High Voltage Pin (pin 8) (Note 2)
Voltage range
Current range
VHVMAX
IHVMAX
–0.3 to 500
$20
V
mA
Driver Pin (pin 5) (Note 2)
Voltage range
Current range
VDRVMAX
IDRVMAX
–0.3 to 20
$1000
V
mA
All other pins (Note 2)
Voltage range
Current range
VMAX
IMAX
–0.3 to 10
$10
V
mA
Thermal Resistance SOIC−7
Junction−to−Air, low conductivity PCB (Note 3)
Junction−to−Air, medium conductivity PCB (Note 4)
Junction−to−Air, high conductivity PCB (Note 5)
RθJ−A
162
147
115
°C/W
Temperature Range
Operating Junction Temperature
Storage Temperature Range
TJMAX
TSTRGMAX
−40 to +150
−60 to +150
°C
ESD Capability (Note 1)
Human Body Model (All pins except HV)
Machine Model
2000
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per JEDEC standard JESD22, Method A114E
Machine Model Method 200 V per JEDEC standard JESD22, Method A115A
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow.


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