Electronic Components Datasheet Search |
|
NCP1235AD065R2G Datasheet(PDF) 4 Page - ON Semiconductor |
|
NCP1235AD065R2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 34 page NCP1235 www.onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Supply Pin (pin 6) (Note 2) Voltage range Current range VCCMAX ICCMAX –0.3 to 28 $30 V mA High Voltage Pin (pin 8) (Note 2) Voltage range Current range VHVMAX IHVMAX –0.3 to 500 $20 V mA Driver Pin (pin 5) (Note 2) Voltage range Current range VDRVMAX IDRVMAX –0.3 to 20 $1000 V mA All other pins (Note 2) Voltage range Current range VMAX IMAX –0.3 to 10 $10 V mA Thermal Resistance SOIC−7 Junction−to−Air, low conductivity PCB (Note 3) Junction−to−Air, medium conductivity PCB (Note 4) Junction−to−Air, high conductivity PCB (Note 5) RθJ−A 162 147 115 °C/W Temperature Range Operating Junction Temperature Storage Temperature Range TJMAX TSTRGMAX −40 to +150 −60 to +150 °C ESD Capability (Note 1) Human Body Model (All pins except HV) Machine Model 2000 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per JEDEC standard JESD22, Method A114E Machine Model Method 200 V per JEDEC standard JESD22, Method A115A 2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow. 5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow. |
Similar Part No. - NCP1235AD065R2G |
|
Similar Description - NCP1235AD065R2G |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |