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PCS3I2005AG-08SR Datasheet(PDF) 2 Page - ON Semiconductor

Part # PCS3I2005AG-08SR
Description  General Purpose Peak EMI Reduction IC
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

PCS3I2005AG-08SR Datasheet(HTML) 2 Page - ON Semiconductor

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PCS3P2005A
http://onsemi.com
2
Figure 1. Block Diagram
GND
ModOUT
VDD
PLL
D_C
S0
FRS
Crystal
Oscillator
XOUT
CLKIN / XIN
Table 1. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
Unit
VDD, VIN
Voltage on any input pin with respect to Ground
−0.5 to +7.0
V
TSTG
Storage temperature
−65 to +125
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
TDV
Static Discharge Voltage (As per JEDEC STD22− A114−B)
2
KV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. PIN DESCRIPTION
Pin#
Pin Name
Type
Description
1
CLKIN / XIN
I
External reference Clock input or Crystal connection.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
3
D_C
I
Deviation Selection. Has an internal pull−up resistor. Refer to Deviation Selection Table.
4
GND
P
Ground connection.
5
S0
I
Deviation Selection. Has an internal pull−up resistor. Refer to Deviation Selection Table.
6
FRS
I
Frequency Range Selection. Has an internal pull−up resistor.
7
ModOUT
O
Buffered Modulated Clock Output.
8
VDD
P
Power supply for the entire chip (3.3 V/5 V).
Table 3. FREQUENCY RANGE SELECTION TABLE
FRS
Frequency (MHz)
0
10 − 30
1
30 − 100
Table 4. DEVIATION SELECTION TABLE
Deviation (%)
D_C
S0
FS = 0
FS = 1
10 MHz
20 MHz
30 MHz
30 MHz
80 MHz
100 MHz
0
0
−4.5
−3.6
−1.7
−4.8
−3.6
−2.6
0
1
−2.6
−2
−1
−2.7
−2
−1.5
1
0
±2.6
±2
±1
±2.75
±2
±1.5
1
1
±1.7
±1.25
±0.7
±1.8
±1.25
±1


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