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SFR16S Datasheet(PDF) 7 Page - Vishay Siliconix |
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SFR16S Datasheet(HTML) 7 Page - Vishay Siliconix |
7 / 10 page SFR16S, SFR25, SFR25H www.vishay.com Vishay BCcomponents Revision: 28-Oct-15 7 Document Number: 28722 For technical questions, contact: filmresistorsleaded@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TESTS PROCEDURES AND REQUIREMENTS All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification (includes tests) The test and requirements table contains only the most important tests. For the full test schedule refer to the documents listed above. The tests are carried out in accordance with IEC 60068-2-xx test method and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Unless otherwise specified the following values apply: • Temperature: 15 °C to 35 °C • Relative humidity: 45 % to 75 % • Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). For performing some of the tests, the components are mounted on a test board in accordance with IEC 60115-1, 4.31. In test procedures and requirements table, only the tests and requirements are listed with reference to the relevant clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A short description of the test procedure is also given. TEST PROCEDURES AND REQUIREMENTS IEC 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( R max.) 4.5 - Resistance - ± 5 %; ± 1 % 4.8 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 250 ppm/K; ± 100 ppm/K 4.12 - Noise IEC 60195 < 68 k 68 k to 100 k > 100 k to 1 M > 1 M SFR16S ≤ 0.1 μV/V ≤ 0.5 μV/V ≤ 1.5 μV/V ≤ 1.5 μV/V SFR25, SFR25H ≤ 0.1 μV/V ≤ 0.1 μV/V ≤ 0.1 μV/V ≤ 1.5 μV/V 4.13 - Short time overload Room temperature; U = 2.5 x or U = 2 x Umax.; 5 s SFR16S, SFR25 ± (0.25 % R + 0.05 ) SFR25H ± (1 % R + 0.05 ) 4.16 21 (Ua1) 21 (Ub) 21 (Uc) Robustness of terminations Tensile, bending, and torsion ± (0.25 % R + 0.05 ) 4.17 20 (Ta) Solderability at +235 °C; 2 s; solder bath method; SnPb40 Good tinning (≥ 95 % covered); no damage at +245 °C; 3 s; solder bath method; SnAg3Cu0.5 4.18 20 (Tb) Resistance to soldering heat Unmounted components (260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 ) 4.19 14 (Na) Rapid change of temperature 30 min at -55 °C and 30 min at +155 °C; 5 cycles ± (0.25 % R + 0.05 ) 4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions; 40 g ± (0.25 % R + 0.05 ); no damage 4.22 6 (Fc) Vibration 10 sweep cycles per direction; 10 Hz to 2000 Hz 1.5 mm or 200 m/s2 ± (0.25 % R + 0.05 ); no damage 4.23 Climatic sequence: 4.23.2 2 (Ba) Dry heat 155 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; 90 % to 100 % RH; 1 cycle 4.23.4 1 (Aa) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; 15 °C to 35 °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; 95 % to 100 % RH; 5 cycles SFR16S, SFR25, SFR25H ± (1 % R + 0.05 ); no visible damage ± (1 % R + 0.05 ); no visible damage ± 2 % R; no visible damage 4.23.7 DC load apply rated power for 1 min |
Similar Part No. - SFR16S_15 |
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Similar Description - SFR16S_15 |
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