TPS51604

SLUSBA6B – DECEMBER 2012 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature (unless otherwise noted)

MIN

MAX

UNIT

VDD

–0.3

6

Input voltage

V

PWM, SKIP

–0.3

6

BST

–0.3

35

BST (transient <20 ns)

–0.3

38

BST to SW; DRVH to SW

–0.3

6

Output voltage

V

SW

–2

30

DRVH, SW (transient <20 ns)

–5

38

DRVL

–0.3

6

Ground pins

GND to PAD

–0.3

0.3

V

–40

125

°C

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

Charged device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

4.5

5

5.5

Input voltage

V

PWM, SKIP

–0.1

5.5

BST

–0.1

34

BST to SW; DRVH to SW

–0.1

5.5

Output voltage

V

SW

–1

28

DRVL

–0.1

5.5

Ground pins

GND to PAD

–0.1

0.1

V

–40

105

°C

6.4 Thermal Information

TPS51604

WSON (DSG)

UNIT

8 PINS

Junction-to-ambient thermal resistance

63.1

°C/W

Junction-to-case (top) thermal resistance

74.1

°C/W

Junction-to-board thermal resistance

34.3

°C/W

Junction-to-top characterization parameter

2.0

°C/W

Junction-to-board characterization parameter

34.9

°C/W

Junction-to-case (bottom) thermal resistance

11.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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