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TPS51604 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS51604 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS51604 SLUSBA6B – DECEMBER 2012 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature (unless otherwise noted) MIN MAX UNIT VDD –0.3 6 Input voltage V PWM, SKIP –0.3 6 BST –0.3 35 BST (transient <20 ns) –0.3 38 BST to SW; DRVH to SW –0.3 6 Output voltage V SW –2 30 DRVH, SW (transient <20 ns) –5 38 DRVL –0.3 6 Ground pins GND to PAD –0.3 0.3 V Operating junction temperature, TJ –40 125 °C Storage temperature range, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal unless otherwise noted. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD 4.5 5 5.5 Input voltage V PWM, SKIP –0.1 5.5 BST –0.1 34 BST to SW; DRVH to SW –0.1 5.5 Output voltage V SW –1 28 DRVL –0.1 5.5 Ground pins GND to PAD –0.1 0.1 V Operating junction temperature, TJ –40 105 °C 6.4 Thermal Information TPS51604 THERMAL METRIC(1) WSON (DSG) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 63.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 74.1 °C/W RθJB Junction-to-board thermal resistance 34.3 °C/W ψJT Junction-to-top characterization parameter 2.0 °C/W ψJB Junction-to-board characterization parameter 34.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 11.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPS51604 |
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