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Serial

Interface

and

Control

12-Bit

DAC B

Latch

SCLK

DIN

CS

OUTA

Power-On

Reset

x2

12

2-Bit

Control

Latch

Power

and Speed

Control

2

Voltage

Bandgap

PGA With

Output Enable

12-Bit

DAC A

Latch

12

REF

AGND

2

12

12

OUTB

x2

Buffer

12

TLV5638

SLAS225C – JUNE 1999 – REVISED JANUARY 2004

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

AVAILABLE OPTIONS

PACKAGE

SOIC

CERAMIC DIP

20 PAD LCCC

(D)

(JG)

(FK)

0°C to 70°C

TLV5638CD

—

—

40°C to 85°C

TLV5638ID

—

—

TLV5638QD

40°C to 125°C

—

—

TLV5638QDR

55°C to 125°C

—

TLV5638MJG

TLV5638MFK

FUNCTIONAL BLOCK DIAGRAM

2