TMP75B-Q1

SBOS721 – OCTOBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

4

V

SDA, SCL, ALERT, A2, A1

–0.3

4

V

Input voltage

A0

–0.3

V

Sink current

SDA, ALERT

10

mA

Operating junction temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–60

150

°C

–2000

2000

Corner pins (1, 4, 5,

Electrostatic discharge

–1000

1000

V

Charged device model (CDM), per

and 8)

AEC Q100-011

Other pins

–1000

1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.4

1.8

3.6

V

–40

125

°C

6.4 Thermal Information

TMP75B-Q1

D (SOIC)

DGK (VSSOP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

125.4

188.1

Junction-to-case (top) thermal resistance

71.5

79.1

Junction-to-board thermal resistance

65.8

109.6

°C/W

Junction-to-top characterization parameter

21.1

15.3

Junction-to-board characterization parameter

65.3

108

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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