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TDA3653C Datasheet(PDF) 11 Page - NXP Semiconductors |
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TDA3653C Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 13 page March 1991 11 Philips Semiconductors Product specification Vertical deflection and guard circuit (90˚) TDA3653B TDA3653C PACKAGE OUTLINES UNIT A A max. 2 A3 b 1 D1 b 2 bc D(1) E(1) Z max. (1) eL P P1 q1 q2 q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 18.5 17.8 3.7 8.7 8.0 A4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 SOT110-1 92-11-17 95-02-25 0 5 10 mm scale 0.25 w D E A A c A2 3 A 4 q 1 q 2 L Q w M b b 1 b 2 D1 P q 1 Z e 19 P pin 1 index SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 |
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