DAC8811

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SLAS411C – NOVEMBER 2004 – REVISED OCTOBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

7

V

Input voltage

–0.3

V

Digital input voltage

GND

–0.3

V

–25

25

V

Operating temperature range

–40

105

°C

125

°C

–65

150

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

7.2 ESD Ratings

MAX

UNIT

±4000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage to GND

2.7

5.5

V

–40

125

°C

7.4 Thermal Information

DAC8811

DGK (VSSOP)

DRB (VSON)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

169.6

46.7

°C/W

Junction-to-case (top) thermal resistance

64.2

61.3

°C/W

Junction-to-board thermal resistance

90.3

22

°C/W

Junction-to-top characterization parameter

7.7

1.1

°C/W

Junction-to-board characterization parameter

88.8

22.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

3.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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