TCC−206

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3

RDL Pin Out

Table 1. PAD DESCRIPTIONS

RDL

Name

Type

Description

Max Voltage

(Note 1)

A1

OUTF

AOH

High Voltage Output F

VHV

A2

VREG

AO

Regulator Output

2

A3

GND_BOOST

P

Ground for Booster

0

A4

VHV

AOH / AIH

Boost High Voltage can be Forced Externally

28

B1

OUTE

AOH

High Voltage Output E

VHV

B2

ATEST

AO

Analog Test Out (Note 4)

VREG

B3

AVDD

P

Analog Supply

5.5

B4

L_BOOST

AOH

Boost Inductor

28

C1

OUTD

AOH

High Voltage Output D

VHV

C2

IDB0

DI

MIPI RFFE ID Bit 0 (Note 3)

VIO

C3

GNDA

P

Analog Ground

0

C4

TRIG

DIO

Trigger Signal Input (Note 2)

VIO

D1

OUTC

AOH

High Voltage Output C

VHV

D2

GNDIO

P

Digital IO Ground

VIO

D3

CS

DI

Chip Select for SPI

VIO

D4

CLK

DI

MIPI RFFE / SPI Clock

VIO

E1

OUTB

AOH

High Voltage Output B

VHV

E2

OUTA

AOH

High Voltage Output A

VHV

E3

VIO

P

Digital IO Supply

2

E4

DATA

DIO

Digital IO (SPI and MIPI RFFE)

VIO

1. For information only.

2. To be grounded when not in use.

3. This pin has to be connected to either GNDIO or VIO level, even if only SPI protocol is used. Never let it float.

4. To be grounded in normal operation.

ELECTRICAL PERFORMANCE SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Rating

Unit

AVDD

Analog Supply Voltage

−0.3 to +6.0

V

VIO

IO Reference Supply Voltage

−0.3 to +2.2

V

Input Voltage Logic Lines (DATA, CLK, CS)

−0.3 to VIO + 0.3

V

VHV Maximum Voltage

−0.3 to 30

V

Human Body Model, JESD22−A114, All I/O

2,000

V

Machine Model, JESD22−A115

200

V

Storage Temperature

−55 to +150

°C

Max Operating Ambient Temperature without Damage

+110

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.