NCP81146

http://onsemi.com

3

Figure 3. Application Circuit

VREG_SW1_HG

VCCP

TP3

VREG_SW1_OUT

VREG_SW1_LG

TP6

TP7

TP8

TP4

TP1

TP2

TP5

NTMFS4851N

NTMFS4851N

Q9

Q10

NTMFS4821N

Q1

NCP81146

BST

PWM

EN

VCC

HG

SW

GND

LG

PAD

DRON

PWM

CSN11

CSP11

C1

C2

C3

CE9

L

R3

C6

R164

12V_POWER

R1

R143

C4

0.027uF

0.0

1.02

C5

1uF

R142

0.0

0.0

2.2

2700pF

235nH

4.7uF

4.7uF

4.7uF

390uF

+

JP13_ETCH

JP14_ETCH

Table 2. ABSOLUTE MAXIMUM RATINGS

Pin Symbol

Pin Name

VCC

Main Supply Voltage Input

15 V

−0.3 V

BST

Bootstrap Supply Voltage

35 V wrt/ GND

40 V ≤ 50 ns wrt/ GND

15 V wrt/ SW

−0.3 V wrt/SW

SW

Switching Node

(Bootstrap Supply Return)

35 V

40 V ≤ 50 ns

−5 V

−10 V (200 ns)

DRVH

High Side Driver Output

BST+0.3 V

−0.3 V wrt/SW

−2 V (<200 ns) wrt/SW

DRVL

Low Side Driver Output

VCC+0.3 V

−0.3 V DC

−5 V (<200 ns)

PWM

DRVH and DRVL Control Input

6.5 V

−0.3 V

EN

Enable Pin

6.5 V

−0.3 V

GND

Ground

0 V

0 V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Symbol

Parameter

Value

Unit

Thermal Characteristic (Note 1)

74

°C/W

Operating Junction Temperature Range (Note 2)

−40 to +150

°C

Operating Ambient Temperature Range

−40 to +125

°C

Maximum Storage Temperature Range

−55 to +150

°C

MSL

Moisture Sensitivity Level

1

* The maximum package power dissipation must be observed.

2. Operation at −40°C to −10°C guaranteed by design, not production tested.