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LMP7704MAX Datasheet(PDF) 6 Page - Texas Instruments |
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LMP7704MAX Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 44 page  LMP7701, LMP7702, LMP7704 SNOSAI9I – SEPTEMBER 2005 – REVISED NOVEMBER 2015 www.ti.com 7.3 Recommended Operating Conditions MIN NOM MAX UNIT Temperature range (1) −40 125 °C Supply voltage (VS = V + – V−) 2.7 12 V (1) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 7.4 Thermal Information LMP7701, LMP7701 LMP7702 LMP7704 LMP7702 DBV D DGK D PW THERMAL METRIC(1) UNIT (SOT-23) (SOIC) (VSSOP) (SOIC) (TSSOP) 5 PINS 8 PINS 8 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance (2) 122.9 114.3 167.5 79.9 107.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 69.3 59.5 58.7 36.9 33.0 °C/W RθJB Junction-to-board thermal resistance 63.3 54.8 87.5 34.7 50.4 °C/W ψJT Junction-to-top characterization parameter 19.4 12.1 6.6 5.5 1.8 °C/W Junction-to-board characterization ψJB 62.8 54.2 86.1 34.4 49.7 °C/W parameter (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 7.5 Electrical Characteristics 3-V Unless otherwise specified, all limits are ensured for TA = 25°C, V + = 3 V, V− = 0 V, V CM = V +/2, and R L > 10 kΩ to V +/2.(1) PARAMETER TEST CONDITIONS MIN (2) TYP (3) MAX (2) UNIT ±37 ±200 LMP7701 at the temperature ±500 extremes VOS Input Offset Voltage μV ±56 ±220 LMP7702/LMP7704 at the temperature ±520 extremes ±1 Input Offset Voltage Temperature TCVOS See (4) μV/°C at the temperature Drift ±5 extremes ±0.2 ±1 See (4) (5) at the temperature −40°C ≤ TA ≤ 85°C ±50 extremes IB Input Bias Current pA ±0.2 ±1 See (4) (5) at the temperature −40°C ≤ TA ≤ 125°C ±400 extremes IOS Input Offset Current 40 fA (1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. (2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the Statistical Quality Control (SQC) method. (3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material. (4) This parameter is specified by design and/or characterization and is not tested in production. (5) Positive current corresponds to current flowing into the device. 6 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated Product Folder Links: LMP7701 LMP7702 LMP7704 |
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