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OPA171AQDBVRQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA171AQDBVRQ1 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 37 page  OPA171-Q1, OPA2171-Q1, OPA4171-Q1 www.ti.com SBOS556C – JUNE 2011 – REVISED DECEMBER 2015 7.2 ESD Ratings VALUE UNIT OPA171-Q1 Human body model (HBM), per AEC Q100-002(1) ±4000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±500 OPA2171-Q1 Human body model (HBM), per AEC Q100-002(1) ±4000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 OPA4171-Q1 Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (V+ – V–) 4.5 (±2.25) 36 (±18) V Specified temperature –40 125 °C 7.4 Thermal Information — OPA171-Q1 and OPA2171-Q1 OPA171-Q1 OPA2171-Q1 THERMAL METRIC(1) DBV (SOT-23) D (SOIC) DGK (VSSOP) UNIT 5 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 277.3 116.1 186.5 °C/W RθJC(top) Junction-to-case(top) thermal resistance 193.3 69.8 78 °C/W RθJB Junction-to-board thermal resistance 121.2 56.6 107.8 °C/W ψJT Junction-to-top characterization parameter 51.8 22.5 15.6 °C/W ψJB Junction-to-board characterization parameter 109.5 56.1 106.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Thermal Information — OPA4171-Q1 OPA4171-Q1 THERMAL METRIC(1) D (SOIC) PW (TSSOP) UNIT 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case(top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.6 Electrical Characteristics At TA = 25°C, VS = 2.7 to 36 V, VCM = VOUT = VS / 2, and RLOAD = 10 kΩ connected to VS / 2, unless otherwise noted. The specified temperature range is TA = –40°C to +125°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage 0.25 ±1.8 mV Input offset voltage over temperature 0.3 ±2 mV Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA171-Q1 OPA2171-Q1 OPA4171-Q1 |
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