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OPA1622 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA1622 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page OPA1622 SBOS727A – NOVEMBER 2015 – REVISED NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS = (V+) – (V–) 40 Voltage Input voltage (Signal Inputs, Enable, Ground) (V–) – 0.5 (V+) + 0.5 V Input differential voltage ±0.5 Input current (all pins except power-supply pins) ±10 mA Current Output short-circuit(2) Continuous Operating, TA –55 125 Temperature Junction, TJ 200 °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to VS / 2 (ground in symmetrical dual supply setups), one amplifier per package. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (V+ – V–) 4 (±2) 36 (±18) V Specified temperature –40 125 °C 6.4 Thermal Information OPA1622 THERMAL METRIC(1) DRC (SON) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 47.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.1 °C/W RθJB Junction-to-board thermal resistance 22.0 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 22.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4.1 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPA1622 |
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