OPA548

www.ti.com

SBOS070C – OCTOBER 1997 – REVISED JUNE 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Output current

See Figure 40

Supply voltage, V+ to V–

60

V

Input voltage

(V–) –0.5V

(V+) + 0.5

V

Input shutdown voltage

V+

Operating temperature

–40

125

°C

Junction temperature

150

°C

Storage temperature

–55

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage (V+-V-)

8(+/-4)

60(±30)

V

Specified temperature

–40

125

°C

7.4 Thermal Information

OPA548

KVT and KC (TO-220)

KTW (DDPAK)

UNIT

7 PINS

7 PINS

Junction-to-ambient thermal resistance

30.2

30.2

°C/W

Junction-to-case (top) thermal resistance

37.4

37.4

°C/W

Junction-to-board thermal resistance

14.4

14.4

°C/W

Junction-to-top characterization parameter

5.1

5.1

°C/W

Junction-to-board characterization parameter

14.3

14.3

°C/W

Junction-to-case (bottom) thermal resistance

0.2

0.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Copyright © 1997–2015, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: OPA548