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OPA548T-1G3 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA548T-1G3 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 39 page OPA548 www.ti.com SBOS070C – OCTOBER 1997 – REVISED JUNE 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Output current See Figure 40 Supply voltage, V+ to V– 60 V Input voltage (V–) –0.5V (V+) + 0.5 V Input shutdown voltage V+ Operating temperature –40 125 °C Junction temperature 150 °C Tstg Storage temperature –55 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply Voltage (V+-V-) 8(+/-4) 60(±30) V Specified temperature –40 125 °C 7.4 Thermal Information OPA548 THERMAL METRIC(1) KVT and KC (TO-220) KTW (DDPAK) UNIT 7 PINS 7 PINS RθJA Junction-to-ambient thermal resistance 30.2 30.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 37.4 37.4 °C/W RθJB Junction-to-board thermal resistance 14.4 14.4 °C/W ψJT Junction-to-top characterization parameter 5.1 5.1 °C/W ψJB Junction-to-board characterization parameter 14.3 14.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.2 0.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1997–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA548 |
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