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OPA228UG4 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA228UG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 46 page OPA227, OPA2227, OPA4227 OPA228, OPA2228, OPA4228 www.ti.com SBOS110B – MAY 1998 – REVISED JUNE 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, Vs = (V+) - (V-) 36 V Voltage (V–) – 0.7 (V+) +0.7 V Signal input terminals Current 20 mA Output short-circuit(2) Continuous Operating temperature –55 125 °C Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground, one amplifier per package 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, Vs = (V+) - (V-) ±2.5 ±15 ±18 V Specified temperature –40 85 °C 6.4 Thermal Information: OPA227U/UA and OPA228U/UA OPA227U/UA OPA2227U/UA OPA4227UA OPA228U/UA OPA2228U/UA OPA4228UA THERMAL METRIC(1) UNIT D (SOIC) D (SOIC) D (SOIC) 8 PINS 8 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 110.1 101.9 65 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.2 46.3 23.1 °C/W RθJB Junction-to-board thermal resistance 52.3 45.5 20.3 °C/W ψJT Junction-to-top characterization parameter 10.4 6.6 1.8 °C/W ψJB Junction-to-board characterization parameter 51.5 42.8 19.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1998–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA227 OPA2227 OPA4227 OPA228 OPA2228 OPA4228 |
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