TLV1701, TLV1702, TLV1704

SBOS589D – DECEMBER 2013 – REVISED JUNE 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

+40 (±20)

V

V

Signal input pins

±10

mA

Continuous

mA

Operating temperature range

–55

+150

°C

150

°C

–65

+150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground; one comparator per package.

7.2 ESD Ratings

VALUE

UNIT

TLV1701 and TLV1702

±2000

Electrostatic discharge

V

±1500

TLV1704

±1000

Electrostatic discharge

V

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.2 (±1.1)

36 (±18)

V

Specified temperature

–40

125

°C

7.4 Thermal Information: TLV1701

TLV1701

DRL (SOT553)

DCK (SC70)

DBV (SOT23)

UNIT

5 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

271.5

283.6

233.1

°C/W

115.6

94.1

156.4

°C/W

Junction-to-board thermal resistance

89.7

61.3

60.6

°C/W

Junction-to-top characterization parameter

17.6

1.9

35.7

°C/W

Junction-to-board characterization parameter

89.2

60.5

59.7

°C/W

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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