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TPA3251D2 Datasheet(PDF) 6 Page - Texas Instruments |
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TPA3251D2 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 39 page TPA3251D2 SLASE40C – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT PVDD_x Half-bridge supply DC supply voltage 12 36 38 V Supply for logic regulators and gate-drive GVDD_x DC supply voltage 10.8 12 13.2 V circuitry VDD Digital regulator supply voltage DC supply voltage 10.8 12 13.2 V RL(BTL) 2.7 4 Output filter inductance within RL(SE) Load impedance 1.5 3 Ω recommended value range RL(PBTL) 1.6 2 LOUT(BTL) 5 LOUT(SE) Output filter inductance Minimum output inductance at IOC 5 μH LOUT(PBTL) 5 Nominal 575 600 625 PWM frame rate selectable for AM FPWM interference avoidance; 1% Resistor AM1 475 500 525 kHz tolerance AM2 430 450 470 Nominal; Master mode 9.9 10 10.1 R(FREQ_ADJ) PWM frame rate programming resistor AM1; Master mode 19.8 20 20.2 k Ω AM2; Master mode 29.7 30 30.3 CPVDD PVDD close decoupling capacitors 1.0 μF ROC Over-current programming resistor Resistor tolerance = 5% 22 30 k Ω ROC(LATCHED) Over-current programming resistor Resistor tolerance = 5% 47 64 k Ω Voltage on FREQ_ADJ pin for slave V(FREQ_ADJ) Slave mode 3.3 V mode operation TJ Junction temperature 0 125 °C 7.4 Thermal Information TPA3251D2 DDV 44-PINS HTSSOP THERMAL METRIC(1) UNIT FIXED 85°C JEDEC STANDARD HEATSINK 4 LAYER PCB TEMPERATURE(2) RθJA Junction-to-ambient thermal resistance 50.7 2.5(2) RθJC(top) Junction-to-case (top) thermal resistance 0.36 0.2 RθJB Junction-to-board thermal resistance 24.4 n/a °C/W ψJT Junction-to-top characterization parameter 0.19 0.5 ψJB Junction-to-board characterization parameter 24.2 n/a RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Thermal data are obtained with 85°C heat sink temperature using thermal compound with 0.7W/mK thermal conductivity and 2mil thickness. In this model heat sink temperature is considered to be the ambient temperature and only path for dissipation is to the heatsink. 6 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPA3251D2 |
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