Si597

Rev. 1.0

5

Table 8. Environmental Compliance and Package Information

Parameter

Conditions/Test Method

Mechanical Shock

MIL-STD-883, Method 2002

Mechanical Vibration

MIL-STD-883, Method 2007

Solderability

MIL-STD-883, Method 2003

Gross and Fine Leak

MIL-STD-883, Method 1014

Resistance to Solder Heat

MIL-STD-883, Method 2036

Moisture Sensitivity Level

J-STD-020, MSL1

Contact Pads

Gold over Nickel

Table 9. Thermal Characteristics

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Thermal Resistance Junction to Ambient



JA

Still Air

—

84.6

—

°C/W

Thermal Resistance Junction to Case



JC

Still Air

—

38.8

—

°C/W

Ambient Temperature

–40

—

85

°C

Junction Temperature

——

125

°C

Parameter

Symbol

Rating

Unit

Maximum Operating Temperature

85

ºC

Supply Voltage, 1.8 V Option

–0.5 to +1.9

V

Supply Voltage, 2.5/3.3 V Option

–0.5 to +3.8

V

Input Voltage (any input pin)

V

Storage Temperature

–55 to +125

ºC

ESD Sensitivity (HBM, per JESD22-A114)

ESD

2000

V

260

ºC

2

20–40

seconds

Notes:

1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional

operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for

extended periods may affect device reliability.

2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at