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Datasheet SPH0645LM4H-B Rev B

Recommended Reflow Profile

Time 25°C to Peak

Ramp-down

Ramp-up

Time

25°C

Notes:

Based on IPC/JDEC J-STD-020 Revision C.

All temperatures refer to topside of the package, measured on the package body surface

Profile Feature

PH-Free

3°C/second max.

Preheat

•

•

•

150°C

200°C

60–180 seconds

Time maintained above:

•

•

217°C

60–150 seconds

260°C

20–40 seconds

6°C/second max

Time 25°C to Peak Temperature

8 minutes max

Additional Notes

(A)

MSL (moisture sensitivity level) Class 1.

(B)

Maximum of 3 reflow cycles is recommended.

(C)

In order to minimize device damage:

• Do not board wash or clean after the reflow process.

• Do not brush board with or without solvents after the reflow process.

• Do not directly expose to ultrasonic processing, welding, or cleaning.

• Do not insert any object in port hole of device at any time.

• Do not apply over 30 psi of air pressure into the port hole.

• Do not pull a vacuum over port hole of the microphone.

• Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.