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SI7020-A20-GMR Datasheet(PDF) 4 Page - Silicon Laboratories |
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SI7020-A20-GMR Datasheet(HTML) 4 Page - Silicon Laboratories |
4 / 36 page Si7020-A20 4 Rev. 1.1 1. Electrical Specifications Unless otherwise specified, all min/max specifications apply over the recommended operating conditions. Table 1. Recommended Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Power Supply VDD 1.9 — 3.6 V Operating Temperature TA I and Y grade –40 — +125 °C Operating Temperature TA G grade –40 — +85 °C Table 2. General Specifications 1.9 < VDD < 3.6 V; TA = –40 to 85 °C (G grade) or –40 to 125 °C (I/Y grade); default conversion time unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit Input Voltage High VIH SCL, SDA pins 0.7xVDD —— V Input Voltage Low VIL SCL, SDA pins — — 0.3xVDD V Input Voltage Range VIN SCL, SDA pins with respect to GND 0.0 — VDD V Input Leakage IIL SCL, SDA pins — — 1 μA Output Voltage Low VOL SDA pin; IOL =2.5 mA; VDD = 3.3 V — — 0.6 V SDA pin; IOL =1.2 mA; VDD =1.9 V —— 0.4 V Current Consumption IDD RH conversion in progress — 150 180 μA Temperature conversion in progress — 90 120 μA Standby, –40 to +85 °C2 —0.06 0.62 μA Standby, –40 to +125 °C2 —0.06 3.8 μA Peak IDD during powerup3 —3.5 4.0 mA Peak IDD during I2C operations4 —3.5 4.0 mA Heater Current5 IHEAT — 3.1 to 94.2 — mA Notes: 1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCONV(T). 2. No conversion or I2C transaction in progress. Typical values measured at 25 °C. 3. Occurs once during powerup. Duration is <5 msec. 4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 µs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands). 5. Additional current consumption when HTRE bit enabled. See Section “5.5. Heater” for more information. |
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