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SI8261AAC-C-IS Datasheet(PDF) 11 Page - Silicon Laboratories |
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SI8261AAC-C-IS Datasheet(HTML) 11 Page - Silicon Laboratories |
11 / 40 page Si826x Rev. 1.3 11 Figure 5. (SOIC-8) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN EN 60747-5-2 and VDE0884-10 Figure 6. (DIP8) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN EN 60747-5-2 and VDE0884-10 Table 8. Thermal Characteristics Parameter Symbol Typ Unit SOIC-8 DIP8 SDIP6 LGA8 IC Junction-to-Air Thermal Resistance JA 110 110 105 220 ºC/W 400 600 800 1000 1200 Ps (mW) Is (mA) 0 200 0 20406080 100 120 140 Ts Case Temperature (°C) 400 600 800 1000 1200 Ps (mW) Is (mA) 0 200 0 20406080 100 120 140 Ts Case Temperature (°C) |
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