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ADP2230ACPZ-1833R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADP2230ACPZ-1833R7 Datasheet(HTML) 5 Page - Analog Devices |
5 / 18 page Data Sheet ADP2230 Rev. A | Page 5 of 18 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VINx, FBx, EN2, SYNC to AGND, PGND −0.3 V to +7 V EN1 −0.3 V to +6 V SWx to AGND, PGND −0.3 V to VINx Operating Ambient Temperature Range −40°C to +85°C Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Absolute maximum ratings apply individually only, not in combination. THERMAL DATA Exceeding the junction temperature (TJ) limit can cause damage to the ADP2230. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. The maximum ambient temperature may require derating in applications with high power dissipation and poor thermal resistance. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature of the device is dependent on the ambient temperature, the power dissipation of the device, and the junction-to-ambient thermal resistance (θJA) of the package. Maximum TJ is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA) (1) θJA of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA can vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. See JEDEC JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages, for detailed information on board construction. For more information, see AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). ΨJB is the junction-to-board thermal characterization parameter with units of °C/W. The ΨJB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path as in junction-to-board thermal resistance (θJB). Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum TJ is calculated from the board temperature (TB) and PD using the formula TJ = TB + (PD × ΨJB) (2) For more information regarding ΨJB, see JESD51-12 and JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions—Junction-to-Board. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. θJC is a parameter for surface-mount packages with top mounted heat sinks. Table 4. Thermal Resistance Package Type θJA θJC Unit 10-Lead, 3 mm × 3mm LFCSP 44.6 5.45 °C/W ESD CAUTION |
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