Si53320

Rev. 1.0

7

Table 9. Absolute Maximum Ratings

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Storage Temperature

–55

—

150

Supply Voltage

–0.5

—

3.8

V

Input Voltage

–0.5

—

VDD + 0.3

V

Output Voltage

——

VDD + 0.3

V

ESD Sensitivity

HBM

HBM, 100 pF, 1.5 kΩ

2000

—

—

V

ESD Sensitivity

CDM

500

—

—

V

Peak Soldering Reflow

Temperature

Pb-Free; Solder reflow

profile per JEDEC J-

STD-020

——

260

Maximum Junction Tem-

perature

——

125

Note:

Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation

specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended

periods may affect device reliability.