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SL2305ZC-1 Datasheet(PDF) 10 Page - Silicon Laboratories |
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SL2305ZC-1 Datasheet(HTML) 10 Page - Silicon Laboratories |
10 / 11 page Rev 2.1, October 22, 2007 Page 10 of 11 SL2305 Package Outline and Package Dimensions 8-Pin TSSOP Package (4.4-mm) 1 4 8 5 6.250(0.246) 6.500(0.256) 4.300(0.169) 4.500(0.177) 2.900(0.114) 3.100(0.122) 0.800(0.031) 1.050(0.041) 0.190(0.007) 0.300(0.012) 0.650(0.025) BSC 0.050(0.002) 0.150(0.006) 1.200(0.047) MAX 0.076(0.003) 0 to 8° 0.500(0.020) 0.750(0.030) 0.250(0.010) BSC Gauge Plane 0.090(0.003) 0.200(0.008) Dimensions are in milimeters (inches) Top line: (MIN) and Bottom line: (Max) Pin-1 ID Seating Plane Thermal Characteristics Parameter Symbol Condition Min Typ Max Unit Thermal Resistance Junction to Ambient Still air - 110 - °C/W 1m/s air flow - 100 - °C/W 3m/s air flow - 80 - °C/W Thermal Resistance Junction to Case Independent of air flow - 35 - °C/W |
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