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BSO615N Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSO615N Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 8 page BSO 615N Data Sheet 2 05.99 Thermal Characteristics Parameter Symbol Unit Values typ. min. max. Characteristics 35 K/W RthJS - - Thermal resistance, junction - soldering point 100 Rth(JA) - Thermal resistance @ 10 sec., min. footprint - 62.5 Rth(JA) - - Thermal resistance @ 10 sec., 6 cm2 cooling area 1) Electrical Characteristics, at Tj = 25 ˚C, unless otherwise specified Parameter Values Symbol Unit typ. min. max. Static Characteristics Drain- source breakdown voltage VGS = 0 V, ID = 0.25 mA V(BR)DSS 60 - - V Gate threshold voltage, VGS = VDS ID = 20 µA VGS(th) 1.2 1.6 2 Zero gate voltage drain current VDS = 60 V, VGS = 0 V, Tj = 25 ˚C VDS = 60 V, VGS = 0 V, Tj = 150 ˚C IDSS - - 0.1 10 1 100 µA Gate-source leakage current VGS = 20 V, VDS = 0 V IGSS - 10 100 nA Drain-Source on-state resistance VGS = 4.5 V, ID = 2.6 A RDS(on) - 0.12 0.15 Ω 1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain connection. PCB is vertical without blown air. |
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