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SKRPACE010 Datasheet(PDF) 3 Page - ALPS ELECTRIC CO.,LTD. |
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SKRPACE010 Datasheet(HTML) 3 Page - ALPS ELECTRIC CO.,LTD. |
3 / 3 page 259 259 検 出 TACT SwitchTM Soldering Conditions 1. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA(K)or CC(T)at solder joints (copper foil surface). A heat resistive tape should be used to fix thermocouple. 2. Temperature profile Condition for Reflow Available for Surface Mount Type. 180 150 260˚C max. 3 sec max. 230˚C Time 120 sec max. (pre-heating) 3 to 4min. Time inside soldering equipment Temperature (˚C ) 40s max. 1. Prevent flux penetration from the top side of the TACT SwitchTM. 2. Switch terminals and a PC board should not be coated with flux prior to soldering. 3. The second soldering should be done after the switch is stable with normal temperature. 4. Use the flux with a specific gravity of min 0.81. (EC-19S-8 by TAMURA Corporation, or equivalents.) Notes 1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Notes Conditions for Auto-dip Available for Snap-in Type and Radial Type. Items Condition Flux built-up Mounting surface should not be exposed to flux Preheating temperature Ambient temperature of the soldered surface of PC board. 100℃ max. Preheating time 60s max. Soldering temperature 260℃ max. Duration of immersion 5s max. Number of soldering 2times max. SKHH, SKPD Series Items Condition Flux built-up Mounting surface should not be exposed to flux Preheating temperature Ambient temperature of the soldered surface of PC board. 110℃ max. Preheating time 60s max. Soldering temperature 260℃ max. Duration of immersion 5s max. Number of soldering 2times max. SKQJ, SKQK, SKEG Series Items Condition Flux built-up Mounting surface should not be exposed to flux Preheating temperature Ambient temperature of the soldered surface of PC board. 100℃ max. Preheating time 45s max. Soldering temperature 255℃ max. Duration of immersion 5s max. Number of soldering 2times max. Manual Soldering Items Condition Soldering temperature 350℃ max. Duration of soldering 3s max. Capacity of soldering iron 60W max. SKHH, SKHW, SKRG, SKPD Series Items Condition Soldering temperature 360℃ max. Duration of soldering 3s max. Capacity of soldering iron 60W max. SKTD, SKTG, SKQJ, SKQK, SKEG Series Items Condition Soldering temperature 350℃ max. Duration of soldering 3s max. Capacity of soldering iron 20W max. |
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