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VND7040AJ Datasheet(PDF) 36 Page - STMicroelectronics |
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VND7040AJ Datasheet(HTML) 36 Page - STMicroelectronics |
36 / 46 page Package and PCB thermal data VND7040AJ 6 Package and PCB thermal data 6.1 PowerSSO-16 thermal data Figure 43: PowerSSO-16 on two-layers PCB (2s0p to JEDEC JESD 51-5) Figure 44: PowerSSO-16 on four-layers PCB (2s2p to JEDEC JESD 51-7) Table 14: PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 77 mm x 86 mm Board Material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Footprint dimension (top layer) 2.2 mm x 3.9 mm Heatsink copper area dimension (bottom layer) Footprint, 2 cm2 or 8 cm2 36/46 DocID027395 Rev 1 |
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