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VNH7100ASTR Datasheet(PDF) 28 Page - STMicroelectronics |
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VNH7100ASTR Datasheet(HTML) 28 Page - STMicroelectronics |
28 / 38 page Package and PCB thermal data VNH7100AS 28/38 DocID028092 Rev 4 Figure 22. PCB 4 layer Note: Board finish thickness 1.6 mm +/- 10%; Board double layer and four layers; Board dimension 77x86 mm; Board Material FR4; Cu thickness 0.070mm (outer layers); Cu thickness 0.035mm (inner layers); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm. 4.2 Package thermal data 4.2.1 Thermal characterization in steady state conditions Figure 23. Chipset configuration configuration in steady state conditions |
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