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54F241DM Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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54F241DM Datasheet(HTML) 5 Page - National Semiconductor (TI) |
5 / 10 page DC Electrical Characteristics (Continued) Symbol Parameter 54F74F Units VCC Conditions Min Typ Max ICCH Power Supply Current (’F240) 19 29 mA Max VO e HIGH ICCL Power Supply Current (’F240) 50 75 mA Max VO e LOW ICCZ Power Supply Current (’F240) 42 63 mA Max VO e HIGH Z ICCH Power Supply Current 40 60 mA Max VO e HIGH (’F241 ’F244) ICCL Power Supply Current 60 90 mA Max VO e LOW (’F241 ’F244) ICCZ Power Supply Current 60 90 mA Max VO e HIGH Z (’F241 ’F244) AC Electrical Characteristics 74F 54F 74F TA ea25 C TA VCC e Mil TA VCC e Com Symbol Parameter VCC ea50V CL e 50 pF CL e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max tPLH Propagation Delay 30 51 70 30 90 30 80 ns tPHL Data to Output (’F240) 20 35 47 20 60 20 57 tPZH Output Enable Time (’F240) 20 35 47 20 65 20 57 tPZL 40 69 90 40 105 40 100 ns tPHZ Output Disable Time (’F240) 20 40 53 20 65 20 63 tPLZ 20 60 80 20 125 20 95 tPLH Propagation Delay 25 40 52 20 65 25 62 ns tPHL Data to Output (’F241 ’F244) 25 40 52 20 70 25 65 tPZH Output Enable Time 20 43 57 20 70 20 67 tPZL (’F241 ’F244) 20 54 70 20 85 20 80 ns tPHZ Output Disable Time 20 45 60 20 70 20 70 tPLZ (’F241 ’F244) 20 45 60 20 75 20 70 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 240241244 SCX Temperature Range Family Special Variations 74FeCommercia QB e Military grade device with 54FeMilitary environmental and burn-in processing Device Type X e devices shipped in 13 reel Package Code Temperature Range P e Plastic DIP CeCommercial (0 Cto a70 C) D e Ceramic DIP MeMilitary (b55 Cto a125 C) F e Flatpak NOTE L e Leadless Chip Carrier (LCC) Not required for MSA package S e Small Outline SOIC JEDEC code MSA e Shrink Small Outline Package (EIAJ SSOP) (’244 only) SJ e Small Outline SOIC EIAJ 5 |
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