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SLE66CX360PEC Datasheet(PDF) 4 Page - Infineon Technologies AG |
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SLE66CX360PEC Datasheet(HTML) 4 Page - Infineon Technologies AG |
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4 / 9 page  SLE 66CX360PE Preliminary - Short Product Information 4 / 9 02.04 Memory Management and Protection Unit • Addressable memory of up to 16 Mbyte • Separates OS (system mode) and application (user mode) • System routines called by interrupts • OS can restrict access to peripherals in application mode • Variable application orientated segments defined and controlled by OS • Code execution from XRAM possible • Enhanced multi-application support by 16 descriptors for system / application mode. Security Features • Enhanced sensor concept: • Low and high voltage sensors • Frequency sensors and filters • Light Sensor • Glitch Sensors • Temperature Sensor • Life Test Function for Sensors (UMSLC) • Bus confusion • Security reset detection • Current control oscillator (ICO) Memory Security • Sparkling SFR encryption for DDES and ACE, CRC module and RNG • 32 bytes security PROM, hardware protected for batch-, wafer-, die-individual security data. Unique chip identification number for each chip • Additional memory for customer-defined security FabKey on request • MED – memory encryption/decryption device for XRAM, ROM and EEPROM • Security optimized layout and layout scrambling • Fast IRAM erase • Enhanced Error correction unit (ECU) Testmode • Irreversible Lock - Out of test-mode Anti Snooping • Automatic randomization smoothing of power profile • Effective HW-countermeasures against SEMA/DEMA, SPA/DPA, DFA and Timing-Attacks • Non standard dedicated Smart Card CPU – Core • Active Shield with automatic and user controlled attack detection • Hardware countermeasures controlled by True Random Number Generator Targeted Certifications • CC EAL5+ • VISA level 3 • MULTOS • SECCOS • CAST Support • HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Softmasking) • Application notes Supported Standards • ISO/IEC 7816 • EMV 2000 • GSM 11.11, 11.12, 11.18 • ETSI TS 102 221 Document References • Confidential Data Book SLE66CxxxPE • Qualification report • Chip delivery specification for wafer with chip-layout (die size, orientation,...) • Module specification containing description of package, etc. • Qualification report module Development Tools Overview • Short Product Information Software Development Kit SDK CC • Short Product Information Card Emulator CE66PE • Short Product Information ROM Monitor RM66PE • Short Product Information Emulator ET66PE Hitex or ET66PE KSC • Short Product Information Smart Mask Package New New New |
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