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TS32101 Datasheet(PDF) 10 Page - Semtech Corporation

Part # TS32101
Description  High Efficiency DC/DC Boost Converter for USB, 2Mhz
Download  12 Pages
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Manufacturer  SEMTECH [Semtech Corporation]
Direct Link  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

TS32101 Datasheet(HTML) 10 Page - Semtech Corporation

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TS32101
Final Datasheet
Rev 2.1
January 26, 2016
www.semtech.com
10 of 12
Semtech
Functional Description (continued)
Packaging Information
Pb-Free (RoHS):TheTS32101devicesarefullycompliantforallmaterialscoveredbyEuropeanUnionDirective2002/95/EC,and
meetallIPC-1752Level3materialsdeclarationrequirements.
MSL, Peak Temp:TheTS32101familyhasaMoistureSensitivityLevel(MSL)1ratingperJEDECJ-STD-020D.Thesedevicesalso
haveaPeakProfileSolderTemperature(Tp)of260°C.
Ordering Information
TS32101-QFNR
Application Using A Multi-Layer PCB
Tomaximizetheefficiencyofthispackageforapplicationonasinglelayerormulti-layerPCB,certainguidelinesmustbefollowed
whenlayingoutthispartonthePCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Package Thermal Pad
Solder Pad (Land Pattern)
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
(square)
Package Solder Pad
Package Solder Pad
(bottom trace)
Thermal Via
Component Traces
Thermal Isolation
Power plane only
1.5748mm
0.0 - 0.071 mm Board Base
& Bottom Pad
0.5246 - 0.5606 mm
Power Plane
(1oz Cu)
1.0142 - 1.0502 mm
Ground Plane
(1oz Cu)
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
2 Plane
4 Plane
Multi-Layer Board (Cross-sectional View)


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