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AN11689 Datasheet(PDF) 7 Page - NXP Semiconductors |
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AN11689 Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 18 page AN11689 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Application note Rev. 1 — 29 July 2015 7 of 18 NXP Semiconductors AN11689 Recommendations for PCB assembly of DSN1006 3.2 Solder pad design for DSN1006 packages (SOD993, SOD995) 3.2.1 Recommended reflow solder footprints Based on the small dimensions of 1006 (0402) devices and the given tolerances for PCB manufacturing, it is recommended to use Non-Solder Mask Defined (NSMD) solder pads. The DSN1006-2 (SOD993) solder footprint with dimensions and the solder footprint together with the package outline are shown in Figure 6. a. Reflow solder footprint b. Reflow solder footprint and package outline Fig 6. Recommended solder footprint for DSN1006-2 (SOD993) aaa-019077 0.6 mm 0.35 mm 0.3 mm 0.35 mm 1 mm aaa-019078 0.6 mm 0.35 mm 0.3 mm 0.35 mm 0.5 mm 0.25 mm 0.25 mm 1 mm |
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