AN11689

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Application note

Rev. 1 — 29 July 2015

7 of 18

NXP Semiconductors

AN11689

Recommendations for PCB assembly of DSN1006

3.2 Solder pad design for DSN1006 packages (SOD993, SOD995)

3.2.1 Recommended reflow solder footprints

Based on the small dimensions of 1006 (0402) devices and the given tolerances for PCB

manufacturing, it is recommended to use Non-Solder Mask Defined (NSMD) solder pads.

The DSN1006-2 (SOD993) solder footprint with dimensions and the solder footprint

together with the package outline are shown in Figure 6.

a. Reflow solder footprint

b. Reflow solder footprint and package outline

Fig 6.

Recommended solder footprint for DSN1006-2 (SOD993)

aaa-019077

0.6 mm

0.35

mm

0.3

mm

0.35

mm

1 mm

aaa-019078

0.6 mm

0.35

mm

0.3

mm

0.35

mm

0.5 mm

0.25

mm

0.25

mm

1 mm