(All voltages referenced to GND.)

COM .....................................................................-0.3V to +0.3V

Continuous Current Into M1, M2 ..........................................±3A

Single-Layer Board (derate at 15.9mW/°C

above +70°C)..........................................................1270mW

Multilayer Board (derate at 24.4mW/°C

above +70°C)..........................................................1951mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150ºC

Storage Temperature Range.............................-65ºC to +150°C

Lead Temperature (soldering, 10s) ................................+300°C

Solder Temperature (reflow) ...........................................+260°C

TDFN-EP (Single-Layer Board)..................................8.5°C/W

TDFN-EP (Multilayer Board).......................................8.5°C/W

TDFN-EP (Single-Layer Board)...................................63°C/W

TDFN-EP (Multilayer Board)........................................41°C/W

(Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Supply Voltage

4.5

36

V

Supply Current

EN = low, M1/M2

not connected

50kHz

1

mA

No switching

0.5

1.2

Shutdown Supply Current

EN = high, driver

is in shutdown

3.7

10

μA

10

20

Undervoltage Lockout

Threshold

3.3

3.8

4.3

V

Undervoltage Lockout

Threshold Hysteresis

400

mV

MAX14870/MAX14872

Compact 4.5V to 36V

Full-Bridge DC Motor Drivers

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics