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MAX16820ATT+T Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX16820ATT+T Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 9 page MOSFET Selection The MAX16819/MAX16820’s gate driver is capable of sourcing 0.5A and sinking 1A of current. MOSFET selection is based on the maximum input operating voltage VIN, output current ILED, and operating switch- ing frequency. Choose a MOSFET that has a higher breakdown voltage than the maximum operation voltage, low RDS(ON), and low total charge for better efficiency. MOSFET threshold voltage must be adequate if operated at the low end of the input-voltage operating range. Freewheeling Diode Selection The forward voltage of the freewheeling diode should be as low as possible for better efficiency. A Schottky diode is a good choice as long as the breakdown voltage is high enough to withstand the maximum operating voltage. The forward current rating of the diode must be at least equal to the maximum LED current. LED Current Ripple The LED current ripple is equal to the inductor current ripple. In cases when a lower LED current ripple is need- ed, a capacitor can be placed across the LED terminals. PCB Layout Guidelines Careful PCB layout is critical to achieve low switching losses and stable operation. Use a multilayer board when- ever possible for better noise immunity. Minimize ground noise by connecting high-current ground returns, the input bypass-capacitor ground lead, and the output-filter ground lead to a single point (star ground configuration). In normal operation, there are two power loops. One is formed when the MOSFET is on and the high current flows through IN— RSENSE—LEDs—Inductor—MOSFET—GND. The other loop is formed when the MOSFET is off when the high current circulates through RSENSE—LEDs—Inductor— freewheeling diode. To minimize noise interaction, each loop area should be as small as possible. Place RSENSE as close as possible to the input filter and IN. For better noise immunity, a Kelvin connection is strongly recommended between CSN and RSENSE. Connect the exposed paddle to a large-area ground plane for improved power dissipation. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 6 TDFN-EP T633+2 21-0137 90-0058 MAX16819/MAX16820 2MHz High-Brightness LED Drivers with High-Side Current Sense and 5000:1 Dimming www.maximintegrated.com Maxim Integrated │ 8 Chip Information PROCESS: BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. |
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