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LM3670MF-1.8 Datasheet(PDF) 4 Page - Texas Instruments |
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LM3670MF-1.8 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 LM3670 SNVS250F – NOVEMBER 2004 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LM3670 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN pin: voltage to GND –0.2 6 V EN pin: voltage to GND –0.2 6 V FB, SW pins (GND −0.2) VIN + 0.2 V Junction temperature, TJ-MAX –45 125 °C Maximum lead temperature (soldering, 10 seconds) 260 °C Storage temperature, Tstg –45 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±200 (1) All voltages are with respect to the potential at the GND pin. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT Input voltage 2.5 5.5 A Recommended load current 0 350 mA Junction temperature, TJ –40 125 °C Ambient temperature, TA –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM3670 UNIT DBV (SOT-23) 5 PINS RθJA Junction-to-ambient thermal resistance 163.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 114.3 °C/W RθJB Junction-to-board thermal resistance 26.8 °C/W ψJT Junction-to-top characterization parameter 12.4 °C/W ψJB Junction-to-board characterization parameter 26.3 °C/W |
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