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LM3670MF-1.8 Datasheet(PDF) 4 Page - Texas Instruments

Part # LM3670MF-1.8
Description  Miniature Step-Down DC-DC Converter for Ultralow Voltage Circuits
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM3670MF-1.8 Datasheet(HTML) 4 Page - Texas Instruments

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4
LM3670
SNVS250F – NOVEMBER 2004 – REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LM3670
Submit Documentation Feedback
Copyright © 2004–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN pin: voltage to GND
–0.2
6
V
EN pin: voltage to GND
–0.2
6
V
FB, SW pins
(GND
−0.2)
VIN + 0.2
V
Junction temperature, TJ-MAX
–45
125
°C
Maximum lead temperature
(soldering, 10 seconds)
260
°C
Storage temperature, Tstg
–45
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±200
(1)
All voltages are with respect to the potential at the GND pin.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
Input voltage
2.5
5.5
A
Recommended load current
0
350
mA
Junction temperature, TJ
–40
125
°C
Ambient temperature, TA
–40
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
LM3670
UNIT
DBV (SOT-23)
5 PINS
RθJA
Junction-to-ambient thermal resistance
163.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
114.3
°C/W
RθJB
Junction-to-board thermal resistance
26.8
°C/W
ψJT
Junction-to-top characterization parameter
12.4
°C/W
ψJB
Junction-to-board characterization parameter
26.3
°C/W


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