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SNVSA30 Datasheet(PDF) 4 Page - Texas Instruments |
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SNVSA30 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 47 page 4 LM36923H SNVSAF3A – FEBRUARY 2016 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LM36923H Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT IN Input voltage –0.3 6 V OUT Output overvoltage sense input –0.3 40 V SW Inductor connection –0.3 40 V LED1, LED2, LED3 LED string cathode connection –0.3 30 V HWEN, PWM, SDA, SCL, ASEL Logic I/Os –0.3 6 V Maximum junction temperature, TJ_MAX 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±500 V may actually have higher performance. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT IN Input voltage 2.5 5.5 V OUT Overvoltage sense input 0 38 V SW Inductor connection 0 38 V LED1, LED2, LED3 LED string cathode connection 0 29.5 V HWEN, PWM, SDA, SCL, ASEL Logic I/Os 0 5.5 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM36923H UNIT YFQ (DSBGA) 12 PINS RθJA Junction-to-ambient thermal resistance 88.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.7 °C/W RθJB Junction-to-board thermal resistance 43.9 °C/W ΨθJT Junction-to-top characterization parameter 2.9 °C/W ΨθJB Junction-to-board characterization parameter 43.7 °C/W |
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