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TLC59116-Q1

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SLDS223A – MARCH 2016 – REVISED MARCH 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

0

7

V

Input voltage

–0.4

V

Output voltage

–0.5

20

V

Output current per channel

120

mA

Junction temperature

–40

150

°C

–55

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1500

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

3

5.5

V

High-level input voltage

SCL, SDA, RESET, A0, A1, A2, A3

V

Low-level input voltage

SCL, SDA, RESET, A0, A1, A2, A3

0

V

Supply voltage to output pins

OUT0 to OUT15

17

V

Low-level output current sink

SDA

20

mA

30

Output current per channel

OUT0 to OUT15

5

120

mA

Operating free-air temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TLC59116-Q1

UNIT

PW (TSSOP)

28 PINS

Junction-to-ambient thermal resistance

78

°C/W

Junction-to-case (top) thermal resistance

18.8

°C/W

Junction-to-board thermal resistance

36

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

35.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W