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TLC59116ITPWRQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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TLC59116ITPWRQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 39 page 5 TLC59116-Q1 www.ti.com SLDS223A – MARCH 2016 – REVISED MARCH 2016 Product Folder Links: TLC59116-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 0 7 V VI Input voltage –0.4 VCC + 0.4 V VO Output voltage –0.5 20 V IO Output current per channel 120 mA TJ Junction temperature –40 150 °C Tstg Storage temperature –55 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±1500 7.3 Recommended Operating Conditions All unused inputs of the device must be held at VCC or GND to ensure proper device operation MIN MAX UNIT VCC Supply voltage 3 5.5 V VIH High-level input voltage SCL, SDA, RESET, A0, A1, A2, A3 0.7 × VCC VCC V VIL Low-level input voltage SCL, SDA, RESET, A0, A1, A2, A3 0 0.3 × VCC V VO Supply voltage to output pins OUT0 to OUT15 17 V IOL Low-level output current sink SDA VCC = 3 V 20 mA VCC = 5 V 30 IO Output current per channel OUT0 to OUT15 5 120 mA TA Operating free-air temperature –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC (1) TLC59116-Q1 UNIT PW (TSSOP) 28 PINS RθJA Junction-to-ambient thermal resistance 78 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.8 °C/W RθJB Junction-to-board thermal resistance 36 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 35.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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