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TPS560200DBVT Datasheet(PDF) 4 Page - Texas Instruments |
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TPS560200DBVT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 22 page 4 TPS560200 SLVSC81C – SEPTEMBER 2013 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TPS560200 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Input voltage VIN –0.3 20 V EN –0.3 7 VSENSE –0.3 3 Output voltage PH –0.6 20 PH 10-ns transient –2 20 Source current EN ±100 µA PH Current limit A Sink current PH Current limit A Operating junction temperature –40 125 °C Storage temperature, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VI Input voltage range 4.5 17 V TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TPS560200 UNIT DBV 5 Pins RθJA Junction-to-ambient thermal resistance 166.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 100 RθJB Junction-to-board thermal resistance 75.5 ψJT Junction-to-top characterization parameter 29.2 ψJB Junction-to-board characterization parameter 3.7 RθJC(bot) Junction-to-case (bottom) thermal resistance 28.7 6.5 Electrical Characteristics TJ = –40°C to 125°C, VIN = 4.5 V to 17 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VOLTAGE (VIN PIN) VIN Operating input voltage 4.5 17 V VIN Internal UVLO threshold VIN Rising 3.9 4.35 4.5 V VIN Internal UVLO hysteresis 200 mV |
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