4

TPS22925

SLVS840C – NOVEMBER 2015 – REVISED FEBRUARY 2016

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Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free–air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

VIN, ON

–0.3

4

V

Output voltage

VOUT

–0.3

4

V

3

A

Maximum pulsed switch current, 100–

μs pulse,

2% duty cycle

4

A

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500–V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500–V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250–V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250–V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

0.65

3.6

V

Output voltage

0

3.6

V

High–level input voltage, ON

0.9

3.6

V

Low–level input voltage, ON

0

0.45

V

Input capacitance

1

µF

Operating free–air temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPS22925xx

UNIT

YPH (DSBGA)

6 PINS

Junction–to–ambient thermal resistance

110.9

°C/W

Junction–to–case (top) thermal resistance

1.2

°C/W

Junction–to–board thermal resistance

30.4

°C/W

Junction–to–top characterization parameter

0.8

°C/W

Junction–to–board characterization parameter

30.4

°C/W