Electronic Components Datasheet Search |
|
TPS22925BYPHT Datasheet(PDF) 4 Page - Texas Instruments |
|
|
TPS22925BYPHT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page 4 TPS22925 SLVS840C – NOVEMBER 2015 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TPS22925 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free–air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage VIN, ON –0.3 4 V Output voltage VOUT –0.3 4 V Maximum continuous switch current at TA = 60°C IMAX 3 A Maximum pulsed switch current, 100– μs pulse, 2% duty cycle IPLS 4 A Junction temperature, TJ 125 °C Storage temperature range, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500–V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500–V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250–V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250–V CDM is possible with the necessary precautions. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human–body model (HBM), per ANSI/ESDA/JEDEC JS–001(1) ±1000 V Charged–device model (CDM), per JEDEC specification JESD22–C101(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage 0.65 3.6 V VOUT Output voltage 0 3.6 V VIH High–level input voltage, ON 0.9 3.6 V VIL Low–level input voltage, ON 0 0.45 V CIN Input capacitance 1 µF TA Operating free–air temperature –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS22925xx UNIT YPH (DSBGA) 6 PINS RθJA Junction–to–ambient thermal resistance 110.9 °C/W RθJC(top) Junction–to–case (top) thermal resistance 1.2 °C/W RθJB Junction–to–board thermal resistance 30.4 °C/W ψJT Junction–to–top characterization parameter 0.8 °C/W ψJB Junction–to–board characterization parameter 30.4 °C/W |
Similar Part No. - TPS22925BYPHT |
|
Similar Description - TPS22925BYPHT |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |