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SP213EHEA Datasheet(PDF) 9 Page - Sipex Corporation |
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SP213EHEA Datasheet(HTML) 9 Page - Sipex Corporation |
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9 / 16 page  9 SP207EHDS/08 SP207EH Series High Performance Transceivers © Copyright 2000 Sipex Corporation WAKEUP FUNCTION The SP213EH has a wake–up feature that keeps two receivers (R 4 and R5) in an enabled state when the device is in the shutdown mode. With only the receivers active during shutdown, the devices draw 5–10 µA of supply current. A typical application of this function would be where a modem is interfaced to a computer in a power–down mode. The ring indicator signal from the modem could be passed through an active receiver in the SP213EH that is itself in the shutdown mode. The ring indicator signal would propagate through the SP213EH to the power management circuitry of the computer to power up the microprocessor and the SP213EH drivers. After the supply voltage to the SP213EH reaches +5.0V, the SHUTDOWN pin can be disabled, taking the SP213EH out of the shutdown mode. All receivers that are active during shutdown maintain 500mV (typical) of hysteresis. ESD TOLERANCE The SP207EH Family incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static dis- charges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. R RC C C CS S R RS S SW1 SW1 SW2 SW2 RC Device Under Test DC Power Source CS RS SW1 SW2 There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potentialtostoreelectro-staticenergyanddischarge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 7. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. TheIEC-1000-4-2,formerlyIEC801-2,isgenerally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 8. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. Figure 7. ESD Test Circuit for Human Body Model |
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