(3.1)

4X 0.705

4X 1.125

(R

) TYP

0.05

8X (0.6)

8X (0.3)

6X (0.65)

(0.208)

(0.905)

(0.663)

(1.325)

SYMM

SOLDER MASK EDGE

PKG

1

4

5

8

9

METAL

TYP

4X (0.6)

4X (0.3)

(1.775)

(2.45)

0.05 MIN

ALL SIDES

3X (0.65)

3X (0.65)

(0.207)

(0.975)

TYP

(R

)

TYP

0.05

(0.245)

(0.905)

TYP

(R

) TYP

0.05

(1.55)

(0.56)

(0.635)

TYP

(

) VIA

TYP

0.2

4X (0.3)

LAND PATTERN EXAMPLE

SYMM

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

1

4

5

8

9

PKG

CSD17551Q3A

www.ti.com

SLPS386B – SEPTEMBER 2012 – REVISED JANUARY 2016

7.2 Q3A Recommended PCB Pattern

1. This package is designed to be soldered to a thermal pad on the board. For more information, see the

QFN/SON PCB Attachment application report, SLUA271.

2. Vias are optional depending on application, refer to device data sheet. If some or all are implemented,

recommended via locations are shown.

text added for spacing

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through

PCB Layout Techniques.

7.3 Q3A Recommended Stencil Pattern

1. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525

may have alternate design recommendations.

Copyright © 2012–2016, Texas Instruments Incorporated

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Product Folder Links: CSD17551Q3A