1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

EP*

*EXPOSED PAD

OUT2

GND

OUT3

OUT4

NC

LDO

VDDIO/EN

FSET

VIN

VIN

NC

FB

PGND

SW

OUT1

GND

PWM

FAULT

ISET

SYNC

TPS61194-Q1

SNVSAE9A – DECEMBER 2015 – REVISED JANUARY 2016

www.ti.com

5 Pin Configuration and Functions

PWP Package

20-Pin TSSOP With Exposed Thermal Pad

Top View

Pin Functions

PIN

DESCRIPTION

NUMBER

NAME

1

VIN

A

Input power pin

2

LDO

A

Output of internal LDO; connect a 1-

μF decoupling capacitor between this pin and noise-free

GND.

3

FSET

A

DC-DC (boost or SEPIC) switching frequency setting resistor.

4

VDDIO/EN

I

Enable input for the device as well as supply input (VDDIO) for digital pins

5

FAULT

OD

Fault signal output. If unused, the pin may be left floating.

Input for synchronizing boost.

6

SYNC

I

If synchronization is not used, connect this pin to GND to disable spread spectrum or to

VDDIO/EN to enable spread spectrum.

7

PWM

I

PWM dimming input.

8

NC

—

No connect

9

GND

G

Ground.

10

ISET

A

LED current setting resistor.

11

GND

G

Ground

Current sink output

12

OUT4

A

This pin must be connected to GND if not used.

Current sink output

13

OUT3

A

This pin must be connected to GND if not used.

Current sink output

14

OUT2

A

This pin must be connected to GND if not used.

Current sink output

15

OUT1

A

This pin must be connected to GND if not used.

16

FB

A

DC-DC (boost or SEPIC) feedback input

17

PGND

G

DC-DC (boost or SEPIC) power ground

18

SW

A

DC-DC (boost or SEPIC) switch pin

19

NC

A

No connect

20

VIN

A

Input power pin

(1)

A: Analog pin, G: Ground pin, P: Power pin, I: Input pin, I/O: Input/Output pin, O: Output pin, OD: Open Drain pin

4

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