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TPS62170, TPS62171, TPS62172, TPS62173

SLVSAT8D – NOVEMBER 2011 – REVISED DECEMBER 2015

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Product Folder Links: TPS62170 TPS62171 TPS62172 TPS62173

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Copyright © 2011–2015, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

–0.3

20

V

EN, SW

–0.3

V

FB, PG, VOS

–0.3

7

V

Power good sink current

PG

10

mA

–40

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3

17

V

–40

85

°C

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPS6217x

UNIT

DSG (WSON)

8 PINS

Junction-to-ambient thermal resistance

61.8

°C/W

Junction-to-case (top) thermal resistance

61.3

°C/W

Junction-to-board thermal resistance

15.5

°C/W

Junction-to-top characterization parameter

0.4

°C/W

Junction-to-board characterization parameter

15.4

°C/W

Junction-to-case (bottom) thermal resistance

8.6

°C/W