TPS65150

SLVS576B – SEPTEMBER 2005 – REVISED JANUARY 2016

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Pin Functions (continued)

PIN

I/O

DESCRIPTION

NAME

VQFN

HTSSOP

Input of the VCOM buffer. If this pin is connected to ground, the VCOM buffer is

IN

14

11

I

disabled.

PGND

10, 11

7, 8

Power ground.

REF

23

20

O

Internal reference output, typically 1.213 V.

Supply pin of the positive, negative charge pump and boost converter gate drive

SUP

12

9

I/O

circuit. This pin should be connected to the output of the main boost converter.

SW

8, 9

5, 6

I

Switch pin of the boost converter.

VCOM

13

10

O

VCOM buffer output. Typically a 1-µF output capacitor is required on this pin.

Positive output voltage to drive the TFT gates with an adjustable fall time. This

VGH

18

15

O

pin is internally connected with a MOSFET switch to the positive charge pump

input CPI.

VIN

7

4

I

This is the input voltage pin of the device.

Thermal Pad

—

—

The thermal pad must to be soldered to GND

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

7

V

Voltages on pin SUP

–0.3

15.5

V

Voltage on pin SW

20

V

Voltage on CTRL

–0.3

7

V

Voltage on GD

15.5

V

Voltage on CPI

32

V

Continuous power dissipation

See Thermal Information

—

Lead temperature (soldering, 10 s)

260

°C

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4

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