PG. 6

8-2.2 Soldering Iron :

8-2.1 Lead Free Solder Re-flow :

cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Note :

8-2. Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

d) 1.0mm tip diameter (max)

Preheating

TP(260°C/40s max.)

60~180s

480s max.

Reflow times: 3 times max

150

25

200

217

Time(sec.)

Within4~5s

Gradual

Cooling

Over 60s.

Iron Soldering times：1 times max

cooling

60~150s

20~40s

Soldering

Natural

cooling

150

350

Preheating

Soldering

Natural

Re-flow soldering temperatures below 240 degrees, there will be unwitting risk

If Use Wave soldering is there will be some risk.

Note.

8. SOLDERIND AND MOUNTING :

8-1. Recommended PC Board Pattern

mechanical stress when warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products can prevent damage from

Fig.1

Fig.2

Common mode filter (RoHS Compliant)

SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

26.03.2014

0.25~0.35

0.5

CMT03 SERIES