SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

6. RELIABILITY & TEST CONDITION :

Resistance to Soldering heat

Vibration

Substrate bending

ITEM

(A total of 6 hours)

the condition shown in the above profile for 1 time.

130~150° C and after it has been immersed to a depth 0.5mm

with new solder smoothly when the sample is taken out of

The specimen shall be stored at standard atmospheric

conditions for 1 hour, after which the measurement shall

There shall be no damage or problems.

The specimen shall be passed through the reflow oven with

the solder bath.

More than 90% of the electrode sections shall be cowered

a temperature of 245± 5° C.

below for 3± 0.2 seconds fully in molten solder M705 with

then be preheated for about 2 minutes in a temperature of

Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated

over the whole of the sample before hard, the sample shall

be applied to the 3 directions (X,Y,Z) for 2 hours each.

a frequency of from 10 to 55Hz/1 minute repeated should

There shall be no mechanical damage.

ΔL/Lo ±10%

≦

There shall be no mechanical damage or

The sample shall be soldered onto the printed circuit board

and when a vibration having an amplitude of 1.52mm and

PERFORMANCE

TEST CONDITION

electrical damage.

The sample shall be soldered onto the printed circuit board

in figure 1 and a load applied until the figure in the arrow

direction is made approximately 3mm.(keep time 30 secs)

PRESSURE ROD figure-1

Solderability

New solder More than 90%

Mechanical

(reflow soldering)

be made.

100

50

20

30

30

20

t = 1.6

Ø4.5

45± 2

45± 2

20

10

R5

R340

Bending test board

ΔL/Lo ±10%

≦

300

250

200

150

100

50

2 min.

10

sec

2 min. or more

150~

180° C

30 sec Min.

(230 ° C )

Soldering

(Peak temperature 260± 3° C 10sec)

Slow cooling

(Stored at room

temperature)

Pre-heating

+0

Low Profile Power Inductors

NOTE : Specifications subject to change without notice. Please check our website for latest information.

SPS5012FT SERIES

19.08.2014