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M21131G-23 Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc.

Part # M21131G-23
Description  72x72/144x144 3.2 Gbps Asynchronous Crosspoint Switch with Amplif-EYE Signal Conditioning
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

M21131G-23 Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc.

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211x1-DSH-001-I
Mindspeed Technologies
®
6
Mindspeed Proprietary and Confidential
1.0 Electrical Characteristics
Unless noted otherwise, specifications in this section are valid with AVDD_CORE = 1.2V, AVDD_IO = 1.8V, and
DVDD_IO = 2.5V power supplies, 25 °C ambient temperature, 800 mVpp differential input/output data swing, PRBS
215– 1 test pattern at 3.2 Gbps, RL = 50
Ω.
Table 1-1.
Absolute Maximum Ratings (1)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
DVDD_IO
Digital logic I/O supply
0
+3.6
V
AVDD_IO
Switch I/O supply
0
+2.7
V
AVDD_CORE
Switch core supply
0
+1.5
V
VCML
DC input voltage (CML)
VSS - 0.5
AVDD_IO + 0.5
V
VCMOS
DC input voltage (CMOS)
VSS - 0.5
DVDD_IO + 0.5
V
Tst
Storage temperature
-65
+150
°C
VESD
Human body model (low-speed)
1000
V
VESD
Human body model (high-speed)
500
V
VESD
Charge device model
150
V
NOTES:
1. Exposure to these conditions over extended periods of time may affect device reliability.
Table 1-2.
Recommended Operating Conditions
Symbol
Parameter
Notes
Minimum
Typical
Maximum
Unit
DVDD_IO
Digital supply voltage
2
+1.71
+1.8/2.5/3.3
+3.47
V
AVDD_IO
Analog I/O supply voltage
2
+1.14
+1.2/1.5/1.8/2.5
+2.63
V
AVDD_CORE
Switch core supply voltage
2
+1.14
+1.2
+1.26
V
Tc
Package heat spreader temperature
1, 3
0
+85
°C
θJC
Junction to Case Thermal Resistance
0.3
C/W
NOTES:
1.
Lower limit is ambient temperature and upper limit is case temperature.
2.
Power supply tolerances are ±5%.
3.
Please refer to the 144 XPS thermal Application Note for thermal design and bolted down heat sink recommendations for this product. The use
of adhesively mounted heatsinks is prohibited.


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