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M21131G-23 Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc. |
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M21131G-23 Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc. |
6 / 65 page 211x1-DSH-001-I Mindspeed Technologies ® 6 Mindspeed Proprietary and Confidential 1.0 Electrical Characteristics Unless noted otherwise, specifications in this section are valid with AVDD_CORE = 1.2V, AVDD_IO = 1.8V, and DVDD_IO = 2.5V power supplies, 25 °C ambient temperature, 800 mVpp differential input/output data swing, PRBS 215– 1 test pattern at 3.2 Gbps, RL = 50 Ω. Table 1-1. Absolute Maximum Ratings (1) Symbol Parameter Minimum Typical Maximum Unit DVDD_IO Digital logic I/O supply 0 +3.6 V AVDD_IO Switch I/O supply 0 +2.7 V AVDD_CORE Switch core supply 0 +1.5 V VCML DC input voltage (CML) VSS - 0.5 — AVDD_IO + 0.5 V VCMOS DC input voltage (CMOS) VSS - 0.5 — DVDD_IO + 0.5 V Tst Storage temperature -65 +150 °C VESD Human body model (low-speed) 1000 — V VESD Human body model (high-speed) 500 — V VESD Charge device model 150 — V NOTES: 1. Exposure to these conditions over extended periods of time may affect device reliability. Table 1-2. Recommended Operating Conditions Symbol Parameter Notes Minimum Typical Maximum Unit DVDD_IO Digital supply voltage 2 +1.71 +1.8/2.5/3.3 +3.47 V AVDD_IO Analog I/O supply voltage 2 +1.14 +1.2/1.5/1.8/2.5 +2.63 V AVDD_CORE Switch core supply voltage 2 +1.14 +1.2 +1.26 V Tc Package heat spreader temperature 1, 3 0 — +85 °C θJC Junction to Case Thermal Resistance 0.3 C/W NOTES: 1. Lower limit is ambient temperature and upper limit is case temperature. 2. Power supply tolerances are ±5%. 3. Please refer to the 144 XPS thermal Application Note for thermal design and bolted down heat sink recommendations for this product. The use of adhesively mounted heatsinks is prohibited. |
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