TGA2594

27-31GHz 5W GaN Power Amplifier

Preliminary Datasheet: Rev A 01-08-14

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Disclaimer: Subject to change without notice

© 2013 TriQuint

www.triquint.com

Mechanical Drawing & Bond Pad Description

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: +/- 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Bond Pad

Symbol

Pad Size

Description

1

RF In

0.125 x 0.200

Input; matched to 50 ohms; DC blocked.

2, 12

0.125 x 0.125

see Application Circuit on page 8 as an example.

3, 11

0.125 x 0.125

see Application Circuit on page 8 as an example.

4, 10

0.125 x 0.125

see Application Circuit on page 8 as an example.

5, 9

0.125 x 0.125

see Application Circuit on page 8 as an example.

6, 8

0.200 x 0.125

see Application Circuit on page 8 as an example.

7

RF Out

0.125 x 0.200

Output; matched to 50 ohms; DC blocked.